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The micro electroforming of precision mold inserts with high flatness via internal stress reduction and interfacial bonding enhancement https://journal.hep.com.cn/jocsu/EN/10.1007/s11771-026-6328-9
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The micro electroforming of precision mold inserts with high flatness via internal stress reduction and interfacial bonding enhancement https://journal.hep.com.cn/jocsu/EN/10.1007/s11771-026-6328-9
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