微博
加入微博一起分享新鲜事
登录
|
注册
140
Parameter fitting of constitutive model and FEM analysis of solder joint thermal cycle reliability for lead-free solder Sn-3.5Ag https://journal.hep.com.cn/jocsu/EN/10.1007/s11771-009-0057-8
请登录并选择要私信的好友
300
Parameter fitting of constitutive model and FEM analysis of solder joint thermal cycle reliability for lead-free solder Sn-3.5Ag https://journal.hep.com.cn/jocsu/EN/10.1007/s11771-009-0057-8
赞一下这个内容
公开
分享
获取分享按钮
正在发布微博，请稍候