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A new material removal rate model for high-shear and low-pressure grinding of single-crystal silicon considering elastohydrodynamic pressure https://journal.hep.com.cn/fme/EN/10.1007/s11465-025-0839-1
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A new material removal rate model for high-shear and low-pressure grinding of single-crystal silicon considering elastohydrodynamic pressure https://journal.hep.com.cn/fme/EN/10.1007/s11465-025-0839-1
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