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Eddy current measurement of the thickness of top Cu film of the multilayer interconnects in the integrated circuit (IC) manufacturing process https://journal.hep.com.cn/fme/EN/10.1007/s11465-015-0325-2
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Eddy current measurement of the thickness of top Cu film of the multilayer interconnects in the integrated circuit (IC) manufacturing process https://journal.hep.com.cn/fme/EN/10.1007/s11465-015-0325-2
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